*Layer Count:
SMT:
1 Side
2 Sides
Copper Weight-Inner Layers:
Copper Weight-Outer Layers:
*Soldermask:
Liquid Photo Imageable S/M
Silkscreen/Legend:
1 Side
2 Sides
mm : Minimum Line Width
mm : Minimum Line Spacing
mm : Min.Annular Ring Width
mm : Min.Hole Size
mm : Min.Hole Tolerance
Controlled Impedance:
YES
NO
*Surface Finish:
Hot Air Leveling
Flash Gold
Gold Finger
Electroless Gold Plating
OSP
Electrical Testing:
YES
NO
*Board Size:
X
*Array Size:
X
#Array units:
*Thickness:
*Total# of Holes:
*Blind Vias:
YES
NO Layers:
*Buried Vias:
Yes
NO Layers:
Other Requirements:
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