Max Layer Count

18

26

Max Board Thickness

0.175¡±

0.200¡±

Min Board Thickness

0.014¡±

0.012¡±

Drill to Metal

0.008¡±

0.007¡±

Innerlayer Registration

+/- 0.003¡±

+/- 0.003¡±

Line Width/Spacing, Outer/Inner (17 micron)

0.003¡± / 0.003¡±

0.003¡± / 0.003¡±

Aspect Ratio

</= 8:1

</= 12:1

Min QFP Pitch (not HASL)

0.016¡±

0.010¡±

Controlled Impedance(Single ended)
        (Differential)

50 - 90 ohms +/- 8%*
100 - 155 ohms +/- 10%*

50 - 90 ohms +/- 7%*
100 - 155 ohms +/- 8%*

Max Internal Copper Wt.

6 oz

6 oz

HDI(1+N+1 Max Layer Count) -Min Via Size
                               - Min Capture Pad Size

0.004¡±
0.012¡±

0.004¡±
0.012¡±